Please fill in the information to download the file

    250100TCxxx

    2501xxWRxxx

    2501xxHAxxx

    2501xxWVxxx
    Series

    250102WV

    Loading file
    • Fullscreen
    • Wireframe
    • Zoom In
    • Zoom Out
    • Rotation
    • Screenshot
    • Help

    Controls

    ×
    • Rotate with the left mouse button.
    • Zoom with the scroll button.
    • Adjust camera position with the right mouse button.
    • Double-click to enter the fullscreen mode.
    • On mobile devices swipe to rotate.
    • On mobile devices pinch two fingers together or apart to adjust zoom.
    • On mobile devices 3 finger horizontal swipe performs panning.
    • On mobile devices 3 finger horizontal swipe performs panning.
    Drawing PDF

    Drawing PDF Download

    Inquiry Cart +

    2501xxWVxxx

    SKU N/A Categories ,
    Inquiry Cart +

    Specification

    UL Approval E237407 Section.1
    Type Wafer
    Pitch 2.50 mm (0.098″)
    Contact Type Wire to Board
    Series 2501
    Current rating 3A AC / DC
    Voltang rating 250V AC / DC
    Withstand voltage 1000V AC / minute
    Insulation resistance 1000M Ω min
    Contact resistance 10m Ω max
    Temperature range -25℃ to + 105℃ (including temperature rise)
    Applicable PC board thickness 0.8 ~ 1.6 mm (0.031″ to 0.063″)
    Circuits 02 – 20P
    Material Nylon 66 UL 94V-0
    Color Natural
    Drawing Drawing PDF Download
    Applicable wires AWG #22~#30
    Insulation O.D 0.9 ~ 1.9 mm
    • No.89, Xinglong Rd., Pingzhen Dist, Taoyuan City 32460, Taiwan(R.O.C.)

    Copyright © 2025 ｜EXCON TECHNOLOGY COMPANY｜Designed by Design-Hu｜Privacy Policy

    Click here
    Scroll to Top

    Please fill in the information to download the file